Our Wafer Ring Frames can be fully customized to meet each customer’s specific process and application requirements. With precision engineering and flexible manufacturing capabilities, we are able to tailor every detail according to your technical specifications.
Customization Options Include:
Mirror finish or matte finish surface treatment based on application requirements
Inner and outer edge chamfering to improve handling safety and prevent cutting injuries
Custom thickness specifications to match process requirements
High flatness control for precision semiconductor applications
Dimensional customization according to customer drawings or specifications
Special surface and mechanical requirements available upon request
We welcome customers to provide any technical requirements, drawings, or application specifications, and our engineering team will work closely with you to deliver a fully customized wafer ring frame solution that meets your exact needs.
